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Also, dirt, corrosion products, and other contaminants must be removed from the assembly prior to the first heating cycle Following the rework procedure, it will be necessary then to reapply conformal coatings and encapsulants as well as to reassemble all hardware Each of these steps must.

where P and Q are the summations of the contributions of the individual pads of a bearing system, p1 = [lbf in 2], Pf = [J s 1] and Q = [in3 s 1]:

now be taken outside the scope of the original assembly process, yet achieve the same quality without ancillary damage to components, circuit boards, or other solder joints A further complication to the rework procedure performed on either post-assembled or field-return hardware is the use of adhesives or staking compounds to anchor the device to the circuit board Because many adhesives used for this purpose are thermosetting, they do not readily soften with the application of heat Care must be exercised when applying heat to soften adhesives so that the temperature rise does not damage the underlying laminate or neighboring components Organic solvents such as those containing alcohols, acetone, methyl chloride, and so on (the use of some of which may be strictly controlled for environmental health and safety reasons) can successfully dissolve a number of adhesive compounds.

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However, it must be confirmed that these solvents do not attack the package materials of the components, the solder mask and laminate, or critical markings Lead-free soldering raises the following two concerns regarding repair and rework procedures: higher melting temperatures of the Pb-free solders, and the mixing of Sn-Pb and Pb-free solders Clearly, the higher melting temperatures of the Pb-free solders increase the likelihood of thermal effects that include remelting of neighboring solder joints and thermal damage to component packages and the circuit board laminate As noted previously, this concern can be readily addressed during process development efforts, through the use of thermocouples placed on the targeted component as well as on neighboring components, solder joints, and circuit board surfaces The second issue is that of mixing Pb-free and Sn-Pb solder.

This situation would be less likely to occur with newly fabricated product, when repair and rework procedures are performed immediately after assembly inspection The same solder would be used for both processes Rather, the concern arises particularly with regard to the rework of legacy products that are returned from service Older, field-return electronics were most likely assembled with a Sn-Pb solder In those cases where Pb-free rework procedures are in full use, there is the likelihood of intermixing Sn-Pb and Pb-free solders in the interconnections In terms of the rework process itself, the poorer solderability of Pb-free solders will be improved by Sn-Pb residues remaining on the circuit board pads (The I/O finish of the replacement component will likely be Pb-free, unless the component was in storage as a lifeof-program-buy [LoPB] for that system Then, the Sn-Pb finish on the I/O will also improve Pb-free solderability.

) However, because there are concerns regarding the long-term reliability of mixed-solder interconnections, it may be necessary to remove more thoroughly any Sn-Pb solder residue from the circuit board pad or through hole Care must be exercised to not overwork the Cu features, which may result in a loss of their adhesion to the laminate (eg, pad lifting) Other degradation modes include excessive dissolution of the Cu features, particularly at the knee on the top and bottom of through-hole barrels as well as damage to the solder mask or underlying laminate material Repair and rework procedures differ between through-hole-mount and surface-mount interconnectionsThat difference is due to the size and geometries of the interconnections, the number of I/Os on the packages, the thermal sensitivity of the components, and the overall density of the printed wiring assemblies The following subsections describe these factors for the two technologies 407.

225 + 398 / 0203 152 t 14 F 8 K It is assumed that for the most heavily loaded pad, the clearance decreases to 0001 in and for the minimum load, the clearance does not exceed 0004 in The calculation can be made in a similar manner with the exception of the stiffness because the design condition is no longer valid The relation is given as

1. 2. 3. 4.

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