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Again, care must be exercised to prevent thermal damage to neighboring components or the undesirable remelting of their solder joints It was noted previously that a Pb-free solder option raises two concerns: the higher soldering temperatures required by the new alloys, and the mixing of Sn-Pb and Pb-free solders, particularly when performing rework procedures on legacy hardware Both concerns are generally of lesser magnitude for through-hole solder joints The physical separation of axial or radial leads lessens the likelihood of thermal damage to the circuit board or replacement component Potential processing and reliability effects resulting for the mixing of Sn-Pb residues with Pb-free solder are less significant due to the greater quantity of solder required in through-hole interconnections In particular, the solder composition within the fillets, which provide most of the strength and service life of the joints, would be least impacted by Sn-Pb contamination..

Surface-Mount Technology Solder-joint repair and the rework of surface-mount components pose a greater challenge due in large part to the reduced size of the devices and associated I/Os. (In fact, the difficulty of repairing or reworking surface-mount circuit boards was one of the leading drivers for the electronics industry, as a whole, to re-embrace more stringent process control techniques, including SPC, to minimize assembly defects.) Contributing hurdles included the higher board densities that accompany the small part sizes; an increased sensitivity of component materials to potential thermal damage including the Si die resulting from flip-chip attachment and thinner molded packages; as well as solder joints that are out of direct view from the operator, as in the case of area-array packages. Another important consideration is the overall fragility of surface-mount Cu pads on the circuit board compared to through-hole structures. In the latter case, damage to the bond between the Cu pad and the laminate was less likely due to a greater robustness of the feature. When such damage in the form of lift-off occurred, it was of a lesser consequence because the hole barrel provided an additional mechanical attachment to the laminate. On the other hand, surface-mount pads are smaller in order to accommodate finer package I/O pitches and overall higher board densities, giving them less overall bond area with which to adhere to the board. Also, the pads are attached to the laminate without a hole or, at best, with only a small via, which also increases the sensitivity of Cu pads to thermal damage in the form of lift-off.

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Repair procedures are typically performed on surface-mount interconnections using hand-soldering techniques A stereomicroscope of 10 to 50 magnification is essential at the workstation The soldering iron tips are miniaturized to accommodate the smaller component sizes and higher board densities In general, this technique does not necessarily reduce the time to repair the smaller solder joints, because the smaller tips also have a reduced thermal mass for supplying heat to the joint As always, the soldering time should be minimized as much as possible Also, in the case of ceramic chip resistors, inductors, and MLTF capacitors, direct contact between the tip and the component termination should be avoided to prevent de-lamination of the metallization It is particularly important to avoid contacting multilayer chip capacitors with the soldering iron, as these materials are particularly sensitive to thermal shock, which can lead to cracking of the device body.

Rework procedures based on hand-soldering techniques are still used for surface-mount technology Manual techniques include equipment innovations that can accommodate the smaller part sizes, multiple I/Os per package, and higher board densities However, it is recognized that more precisely controlled procedures are required for reworking fine-pitch, peripherally leaded packages and area-array components (BGAs, CSPs, and flip-chip) Often, an operator simply does not have the physical ability to perform the necessary actions or to execute steps that must be done simultaneously Therefore, rework stations are available that can perform some or all of the steps in a semiautomated or even fully automated fashion, depending on the equipment capabilities Predetermined thermal profiles are used to remove a defective component and then to install the new part Positioning of the replacement part is achieved manually or by stepper motors that can be executed manually or controlled by software commands.

Feed hole diameter d (in 10 3)

4 (+5V)

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